SS-P Subminiature Basic Switch

Cautions

●Soldering

•Connecting to Solder Terminals
Complete the soldering at the iron tip temperature of 350 to 400°C within 5 seconds, and do not apply any external force for 1 minute after soldering. Soldering at an excessively high temperature or soldering for more than 5 seconds may deteriorate the characteristics of the Switch.

•Connecting to PCB terminals
When using automatic soldering baths, we recommend soldering at 260±5°C within 5 seconds. Make sure that the liquid surface of the solder does not flow over the edge of the board.
When soldering terminals manually, complete the soldering at the iron tip temperature between 350 to 400°C within 3 seconds, and do not apply any external force for 1 minute after soldering. When applying solder, keep the solder away from the case of the Switch and do not allow solder or flux to flow into the case.

Correct Use

●Mounting

•Use M2.3 mounting screw with plane washers or spring washers to securely mount the Switch. Tighten the screws to a torque of 0.23 to 0.26 Nm {2.3 to 2.7 kgf cm}.

●Using Micro Loads

·Using a model for ordinary loads to open or close the contact of a micro load circuit may result in faulty contact. Use models that operate in the following range. However, even when using micro load models within the operating range shown below, if inrush current occurs when the contact is opened or closed, it may increase contact wear and so decrease durability. Therefore, insert a contact protection circuit where necessary.The minimum applicable load is the N-level reference value. This value indicates the malfunction reference level for the reliability level of 60% (λ60).
(JIS C5003)
The equation, λ60 = 0.5 × 10-6/operations indicates that the estimated malfunction rate is less than 1/2,000,000 operations with a reliability level of 60%.