Product Details Portlet

G3VM-□MT MOS FET Relay Module

1 pA max. leakage current*
contributes to high device reliability

  • Equipped with a T-switch function to achieve fA-level minimal
    leakage current and contributes to measurement performance
    equivalent to conventional reed relays
  • Contact form: 1a (SPST-NO) + T-switch function
  • Contributes to reduction of the mounting space on the printed
    circuit board with a small package
    * VOFF =20 V, 50 V, 80 V
  • G3VM-xxMT MOS FET Relay Module
    Introduction of G3VM-xxMT

    G3VM-xxMT allows high-precision measurement and improves productivity of electronic components.

RoHS Compliant
Note: This web page provides an excerpt from a datasheet. Refer to Product Datasheet and other applicable documents for more information.

Ordering Information

Package Contact form Terminals Load voltage
(peak value)
Continuous load current
(peak value)
Tape cut packaging Tape packaging
Main Sub Model Minimum
Model Minimum
Module 1a
20 V 200 mA G3VM-21MT 1 pc. G3VM-21MT (TR01) 100 pcs.
60 V 800 mA 400 mA G3VM-61MT G3VM-61MT (TR01)
100 V 550 mA G3VM-101MT G3VM-101MT (TR01)

Absolute Maximum Rating (Ta=25°C)

Item Symbol G3VM-21MT G3VM-61MT G3VM-101MT Unit Measurement conditions
Input LED forward current for main control IF Main 30 mA  
LED forward current for sub control IF Sub 30 mA  
LED forward current reduction rate ΔIF/°C -0.3 mA/°C Ta ≥ 25°C
LED reverse voltage VR 5 V  
Junction temperature Tj 125 °C  
Output Load voltage (AC peak/DC) VOFF 20 60 100 V  
Continuous load current
IO Main 200 800 550 mA  
IO Sub 400  
ON current reduction rate ΔIO Main/°C -2 -8 -5.5 mA/°C Ta ≥ 25°C
ΔIO Sub/°C -4
Pulse ON current IOP 600 2400 1650 mA t=100 ms, Duty=1/10
Junction temperature Tj 125 °C  
Dielectric strength between I/O VI-O 500 Vrms AC for 1 min
Ambient operating temperature Ta -40 to 110 °C With no icing or condensation
Ambient storage temperature Tstg -40 to 125 °C
Soldering temperature - 260 °C 10 s

Electrical Characteristics (Ta=25°C)

Item Symbol G3VM-21MT G3VM-61MT G3VM-101MT Unit Measurement conditions
Input LED forward voltage
for main control
VF Main Minimum 2.2 V IF Main=10 mA
Typical 2.54 2.42
Maximum 2.8
LED forward voltage
for sub control
VF Sub Minimum 1.1 IF Sub=10 mA
Typical 1.27 1.21
Maximum 1.4
Capacitance between
main control terminals
CT Main Typical 15 pF V=0, f=1 MHz
Capacitance between
sub control terminals
CT Sub Typical 30
Trigger LED forward
IFT Main/Sub Maximum 3 mA IO=100 mA
Release LED forward
IFC Main/Sub Minimum 0.1 IOFF=10 uA
Output Maximum resistance
with output ON
RON Main Typical 8 0.4 0.8 Ω IF Main=5 mA, t < 1 s
IO Main=Continuous load current rated value
Maximum 12 0.8 1.5
Current leakage when
the main line is open and sub line is close ∗1
ILEAK Maximum 1 pA G3VM-21MT:VDD=20 V
G3VM-61MT:VDD=50 V
G3VM-101MT:VDD=80 V∗1
Capacitance between
COFF Typical 0.6 38 23 pF V=0, f=1 MHz
Maximum 1 -
Capacitance between I/O terminals CI-O Typical 1
Insulation resistance
between I/O terminals
RI-O Minimum 1000 VI-O=500 VDC, ROH ≤ 60%
Typical 108
Main line Turn-ON time tON Main Typical - 0.75 0.6 ms G3VM-21MT:VDD=10 V,
G3VM-61MT/101MT:VDD=20 V,
IF Main=5 mA, RL=200 Ω∗2
Maximum 0.3 2.5
Main line Turn-OFF time tOFF Main Typical - 0.04
Maximum 0.3 0.5
Sub line Turn-ON time tON Sub Typical - 0.2 0.6 G3VM-21MT:VDD=10 V,
G3VM-61MT/101MT:VDD=20 V,
IF Main=5 mA, IF Sub=5 mA, RL=200 Ω∗3
Maximum 0.3 1 2.5
Sub line Turn-OFF time tOFF Sub Typical - 0.04
Maximum 0.3 0.5

Recommended Operating Conditions

For usage with high reliability, Recommended Operation Conditions is are measures that take into account the derating of Absolute Maximum Ratings and Electrical Characteristics.
Each item on this list is an independent condition, so it is not simultaneously satisfying conditions.

Item Symbol G3VM-21MT G3VM-61MT G3VM-101MT Unit
Load voltage (AC peak/DC) VDD Maximum 16 48 80 V
Operating LED forward current IF Minimum 5 mA
Typical 7.5
Maximum 20
Continuous load current (AC peak/DC) IO Main Maximum 200 800 550
IO Sub 400
Ambient operating temperature Ta Minimum -20 °C
Maximum 85

Connection Example 1

Device Functional Modes
Circuit Control MOS FET RELAY
A, C (Main line)
B (Sub line)
  • Timing Diagram
    Timing Diagram
  • Measurement Circuit
    Measurement Circuit

Connection Example 2

Device Functional Modes
A, C (Main line)
B (Sub line)
  • Timing Diagram
    Timing Diagram
  • Measurement Circuit
    Measurement Circuit


(Unit: mm)

  • Surface-mounting Terminals

    Weight: 0.11 g

    Surface-mounting Terminals
  • Actual Mounting Pad Dimensions (Recommended Value, Top view)
    Actual Mounting Pad Dimensions
    Unless otherwise specified, the dimensional tolerance is ± 0.1 mm.

Appearance / Terminal Arrangement / Internal Connections

  • Appearance
  • Terminal Arrangement / Internal Connections (Top view)
    Terminal Arrangement/Internal Connections


Precautions for Safe Use

  1. Do not apply overvoltages or overcurrents to the input or output circuits of the product.
    The product may fail or ignite.
  2. Perform soldering and wiring correctly according to specified soldering conditions.
    Using a product with incomplete soldering may cause overheating when power is applied, possibly resulting in burning.

Precautions for Correct Use


You must consider derating to achieve the required system reliability.
To use a product with high reliability, consider derating the maximum ratings and recommended operating conditions, and allow sufficient leeway in designs based on testing operation in the actual application under the actual operating conditions whenever possible.

  1. Maximum Ratings
    The maximum ratings must never be exceeded even instantaneously. This applies individually to each of the ratings. If any of the maximum ratings is exceeded, the internal parts of the product may deteriorate or the chip may be destroyed. To ensure high reliability in using a product, sufficiently derate the maximum voltage, current, and temperature ratings when designing the application.
  2. Recommended Operating Conditions
    The recommended operating conditions are to ensure that the product turns ON and OFF reliably.
    To ensure high reliability in using a product, consider the recommended operating conditions when you design the application.
  3. Fail-Safe Design
    We recommend that you implement fail-safe measures in the design of the application if the failure of, deterioration of characteristics in, or functional errors in the product will have a serious affect on the safe operation of the system.
Countermeasures for static electricity

There is a risk of damage to internal elements and impairment of functionality if static electricity is discharged to the pins due to product handling or otherwise.
Reduce the generation of static electricity as much as possible, and implement appropriate measures to prevent charge accumulation near the product.

Typical Product Driving Circuit Examples

The LED input side of the MOS FET is driven by current. If applying a voltage, add resistance in series with the circuit, so the specified current is applied.
This resistance is referred as "LED current limiting resistance."

  • C-MOS
  • Transistor
  • To ensure that the product operates correctly, use the following formula to calculate the limiting resistance, and design the circuit accordingly.

  • To ensure that the product resets reliably, calculate the reset voltage using the formula below, and control so that the voltage is lower than this value.

  • If the drive transistor has a large leakage current that may cause malfunctioning, add a bleeder resistance.
Protection from Surge Voltage on the Input Pins
  • If any reversed surge voltage is imposed on the input pins, insert a diode in parallel with the input pins as shown in the following circuit diagram and do not impose a reversed voltage of 3 V or higher.

    Surge Voltage Protection Circuit Example
Protection from Spike Voltage on the Output Pins
  • If there is an inductive load or other condition that will cause overvoltage that exceeds the absolute maximum rating between the output pins, connect a protective circuit to limit the overvoltage.

    Spike Voltage Protection Circuit Example
Load Connection
  1. Do not short-circuit the input and output pins while the product is operating or it may malfunction.
  2. Do not connect the input and output in reverse.
  3. Do not construct a circuit so that overcurrent and burning occur if the 4, 5 and 6 pins are short-circuited.
  1. When transportation and installing the product, do not drop the product or subject it to abnormal vibration or shock. It may cause deterioration of product characteristics, malfunction or failure.
  2. Avoid transportation in the following conditions as it may cause failure or deterioration of characteristics.

    • Circumstance subject to water or oil.
    • Circumstance subject to high temperature or high humidity.
    • Circumstance where the temperature changes radically and condensation occurs.
    • State the product is not packed.
Cleaning Flux from the products
  1. Clean flux from the product so that there will be no residue of reactive ions, such as sodium or chlorine.
    Some organic solvents will react with water to produce hydrogen chloride or other corrosive gases, which may cause deterioration of the products.
  2. When washing off the flux with water, make sure that there will be no residue of reactive ions, particularly sodium or chlorine.
  3. During water washing, do not scrub the marks on the surface of the product with a brush or your hand while there is cleaning liquid on the product. The marks may come off.
  4. Clean the flux from the products with the chemical action of the solvent for submersed cleaning, shower cleaning, or steam cleaning. To minimize the effect on the products, do not place the product in the solvent or steam for more than 1 minute at a temperature of 50°C.
  5. If you use ultrasonic cleaning, keep the time short. If the cleaning time is too long, the sealing characteristics of the molded resin and frame materials may deteriorate.
    The recommended basic conditions are given below.

    Recommended Conditions for Ultrasonic Cleaning:

    Frequency: 27 to 29 kHz
    Ultrasonic wave output: 300 W max. (0.25 W/cm2 max.)
    Cleaning time: 30 s max.

    Also, suspend the products in the cleaning solution so that the product and PCB do not come into direct contact with the ultrasonic transducer.

  6. Dry thoroughly after washing so that there is no residue of washing liquid.
Solder Mounting

Perform solder mounting under the following recommended conditions to prevent the temperature of the MOS FET Relays from rising.

(Lead-free solder) SnAgCu recommended profile
Manual Soldering (Once Only)

Perform manual soldering at 260°C for 10 s or less.

Storage Conditions
  1. Store the products where they will not be subjected to water leaks or direct sunlight.
  2. When transporting or storing the product, observe all precautions on the packaging boxes.
  3. Keep the storage location at normal temperature, normal humidity, and normal pressure. Guidelines for the temperature and humidity are 5 to 35°C and a relative humidity of 45% to 75%.
  4. Do not store the product in locations that are subject to corrosive gases, such as hydrogen sulfide gas, or to salt spray, and do not store them where there is visually apparent dust, iron powder or dirt.
  5. Store the product in a location that has a relatively stable temperature. Radical changes in temperature during storage will cause condensation, which may oxidize or corrode the leads and interfere with solder wetting.
  6. If you remove products from the packages and then store them again, use storage containers that have measures to prevent static electricity.
  7. Do not under any circumstances apply any force to the products that would deform or alter them in any way.
  8. This product is warranted for one year from the date of purchase or the date of delivery to the specified location.
    If the products are stored for more than about one year under normal conditions, we recommend that you confirm solderability before you use the products.
Usage Conditions
< Mounting >

Do not install the product with oil or metal powder.
This may cause insulation deterioration.

< Temperature >

The electrical characteristics of the products are limited by the application temperature.
If you use them at temperatures outside of the operating temperature range, the electrical characteristics of the products will not be achieved and the products may deteriorate. For that reason, you must determine the temperature characteristics in advance and apply derating* to the design of the application. (*Derating reduces stress.) Consider derating in the operating temperature conditions and apply the recommended operating temperature as a guideline.

< Humidity >

To ensure long-term reliability, consider derating the operating humidity conditions and operate within the following humidity range.
When operating in a high-humidity environment, moisture intrusion may cause deterioration or failure of the internal semiconductor elements. Also, in systems with high signal source impedance, leakage current between the board and product reeds can cause a malfunction.
When operating in a low-humidity environment, suppress the generation of static electricity as much as possible and take appropriate measures to prevent static electricity buildup around the product.
Static electricity discharge may damage the semiconductors inside the element and prevent normal operation.

the operating humidity conditions
< Replace >
  • Be sure to turn off the power when replacing parts. There is a risk of electric shock.
< Disposal >
  • This product uses compound semiconductors containing GaAs (gallium arsenide). Do not destroy, cut, crush or chemically decompose the product as the powder and vapor generated are harmful to the human body.
Considerations when handling Products
< Moisture proof package, MSL5 >

Surface mount products may have a crack when thermal stress is applied during surface mount assembly after they absorb atmospheric moisture. Therefore, please observe the following precautions.

  1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
    Temperature: 5°C to 30°C
    Humidity: 90% (Max.)
  2. After opening the moisture proof bag, the devices should be assembled within 48 hours in an environment of 5°C to 30°C / 60%RH or below.
  3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 48 hours, but perform baking only once.
    Baking conditions: 120±5°C. For 72 hours.
    Expiration date: 12 months from sealing date, which is imprinted on the label affixed.
  4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it.
  5. If the packing material of laminate would be broken the hermeticity would deteriorate.
    Therefore, do not throw or drop the packed devices.
  6. Tape-cut products are packaged without humidity resistance. Use manual soldering to mount them. (MSL not supported)